New type of paste with enhanced thermal conductivity for modules

Henkel International - Press & Media Relations >> 
02/14/2013 - Düsseldorf / Germany

Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must be integrated as early as their design phase. Only then can reliable cooling be safeguarded over the long term. A particularly important role is assigned to thermal conduction at the link between the component and the heat sink. In these cases, materials are often used that cannot meet the growing requirements. In its search for a remedy, Infineon Technologies AG has incorporated a TIM material solution from Henkel Electronic Materials to now make available a heat conducting compound optimized specifically for the architecture of power semiconductors in modules.

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