Adhesives

Less energy, more efficiency – through lower application temperature

Henkel International - Press & Media Relations >> 
09/29/2011 - Düsseldorf / Germany

With its new non-hazardous polyurethane hotmelt Purmelt MicroEmission Cool 3400 for perfect binding of books and brochures, Henkel is providing the first powerful adhesive with an application temperature of less than 100 degrees Celsius. This reduces energy consumption and significantly speeds up processes. The result is an extremely strong bond and reliable processing, even with low adhesive consumption.


For more solutions please try www.hazeng.com or www.engineeringtrader.com
Pin It

This website is owned and operated by: MSL Media Limited

msl logo
www.mslmedialtd.com

Co. Number: 05359182

© 2005 MSL Media Ltd. All rights reserved. E&OE

ems logo mobile