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Henkel develops underfill for next-generation flip chip devices
Adhesives
20th November 2012
Henkel International - Press & Media Relations >> 08/22/2012 - Düsseldorf / Germany
Addressing the challenges associated with ever-thinner flip chip die, Henkel has developed a new high-performance underfill: Loctite Eccobond UF 8840 reduces package stress through controlling die and substrate warpage and thus meets the demands of modern semiconductor flip chip devices.
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