Adhesives

With Loctite Ablestik CDF 200P, Henkel introduces a precut combination of dicing film and conductive die attach film. As the only materials supplier with proven conductive die attach film technology, Henkel is effectively enabling new device designs that demand thinner die and more die per package. Loctite Ablestik CDF 200P is a pre-cut film, available for 6” or 8” wafers while its predecessor, Loctite Ablestik C100, is a conductive die attach film in roll format.

Over a dozen different adhesives made by Henkel ensure that the products manufactured by the UK’s largest kitchen company are not only perfectly bonded but also look good.

Addressing the challenges associated with ever-thinner flip chip die, Henkel has developed a new high-performance underfill: Loctite Eccobond UF 8840 reduces package stress through controlling die and substrate warpage and thus meets the demands of modern semiconductor flip chip devices.